Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/118072
Kind Code:
A1
Abstract:
Disclosed is a circuit board which has a reduced size.
Specifically disclosed is a circuit board (10) in which an electronic component can be installed. A substrate main body (12) comprises multiple insulation layers (14a, 15a, 14b) laminated on each other. A coil conductor (16a) is integrated in the substrate main body (12). A coil conductor (16b) is integrated in the substrate main body (12) and is magnetically connected to the coil conductor (16a) to form, together with the coil conductor (16a), a common mode choke coil.
Inventors:
WATANABE Kazutaka (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2010/068624
Publication Date:
September 29, 2011
Filing Date:
October 21, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
International Classes:
H05K1/16; H01F17/00; H01F19/04; H05K1/02
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (Hommachi Eiwa Building, 2-10 Minamihommachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
Claims: