Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/118072
Kind Code:
A1
Abstract:
Disclosed is a circuit board which has a reduced size.
Specifically disclosed is a circuit board (10) in which an electronic component can be installed. A substrate main body (12) comprises multiple insulation layers (14a, 15a, 14b) laminated on each other. A coil conductor (16a) is integrated in the substrate main body (12). A coil conductor (16b) is integrated in the substrate main body (12) and is magnetically connected to the coil conductor (16a) to form, together with the coil conductor (16a), a common mode choke coil.
Inventors:
WATANABE KAZUTAKA (JP)
Application Number:
PCT/JP2010/068624
Publication Date:
September 29, 2011
Filing Date:
October 21, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
WATANABE KAZUTAKA (JP)
WATANABE KAZUTAKA (JP)
International Classes:
H05K1/16; H01F17/00; H01F19/04; H05K1/02
Foreign References:
| JP2005340577A | 2005-12-08 | |||
| JP2001160510A | 2001-06-12 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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Claims: