Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/054335
Kind Code:
A1
Abstract:
Provided is a highly smooth circuit board that is capable of reducing transmission loss of a high-frequency electrical signal. A circuit board according to the present invention is characterized by being provided with a wiring part and a non-wiring part, wherein: the wiring part has a metal layer and a resin layer; the non-wiring part has a resin layer; and the resin layer has a relative dielectric constant of 2-3 at a frequency of 10 GHz at 23°C, and satisfies relationship of (A-B)/B≤0.1, where A (µm) represents the maximum value of the thickness in the wiring part, and B (µm) represents the minimum value of the thickness in the non-wiring part.
Inventors:
NISHIMURA ISAO (JP)
MIYAKI NOBUYUKI (JP)
KADOTA TOSHIAKI (JP)
FUJITOMI SHINTAROU (JP)
SHINODA TOMOTAKA (JP)
MIYAKI NOBUYUKI (JP)
KADOTA TOSHIAKI (JP)
FUJITOMI SHINTAROU (JP)
SHINODA TOMOTAKA (JP)
Application Number:
PCT/JP2018/033480
Publication Date:
March 21, 2019
Filing Date:
September 10, 2018
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H05K1/03; B32B15/08; H05K3/28; H05K3/46
Domestic Patent References:
| WO2016114287A1 | 2016-07-21 | |||
| WO2016143447A1 | 2016-09-15 | |||
| WO2012014339A1 | 2012-02-02 |
Foreign References:
| JP2008039703A | 2008-02-21 | |||
| JP2001301088A | 2001-10-30 | |||
| JP2014197611A | 2014-10-16 | |||
| JP2015176921A | 2015-10-05 | |||
| JP2016087799A | 2016-05-23 | |||
| JP2016032098A | 2016-03-07 | |||
| JP2015209511A | 2015-11-24 | |||
| JP2017197725A | 2017-11-02 | |||
| JP2018024827A | 2018-02-15 | |||
| JP2009231770A | 2009-10-08 |
Other References:
See also references of EP 3684146A4
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
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