Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/251795
Kind Code:
A1
Abstract:
A printed circuit board according to an embodiment comprises: an insulating layer comprising first to a third regions; an outer layer circuit pattern disposed on the top surfaces of the first to third regions of the insulating layer; and a solder resist comprising a first part disposed in the first region of the insulating layer, a second part disposed in the second region of the insulating layer, and a third part disposed in the third region of the insulating layer, wherein the outer layer circuit pattern comprises: a first trace disposed on the top surface of the first region of the insulating layer; and a second trace disposed on the top surface of the third region of the insulating layer, the height of the first trace is different from the height of the second trace, and the top surface of the first part of the solder resist is positioned to be lower than the top surface of the first trace.
Inventors:
NA SE WOONG (KR)
HAN JUNG EUN (KR)
KIM MOO SEONG (KR)
HAN JUNG EUN (KR)
KIM MOO SEONG (KR)
Application Number:
PCT/KR2021/007338
Publication Date:
December 16, 2021
Filing Date:
June 11, 2021
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/06; H05K3/28; H05K3/46
Foreign References:
| KR20140018016A | 2014-02-12 | |||
| JP2015050307A | 2015-03-16 | |||
| KR20170037331A | 2017-04-04 | |||
| JP2017152477A | 2017-08-31 | |||
| JP2015216332A | 2015-12-03 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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