Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/042770
Kind Code:
A1
Abstract:
This circuit board includes: a first conductor; a second conductor; a transmission line disposed between the first conductor and the second conductor; a first dielectric layer that is disposed between the first conductor and the transmission line and includes at least one first dielectric; and a second dielectric layer that is disposed between the second conductor and the transmission line and includes at least one second dielectric. The second dielectric layer is configured to be thicker than the first dielectric layer. The permittivity and/or the dielectric loss tangent of the first dielectric are less than the permittivity and/or the dielectric loss tangent of the second dielectric.
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Inventors:
KAWAJI SATOSHI (JP)
NISHIKIDO MASAMITSU (JP)
MURAKAMI YOUHEI (JP)
SATO MASAYUKI (JP)
NISHIKIDO MASAMITSU (JP)
MURAKAMI YOUHEI (JP)
SATO MASAYUKI (JP)
Application Number:
PCT/JP2022/033961
Publication Date:
March 23, 2023
Filing Date:
September 09, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01P3/08; H05K3/46
Domestic Patent References:
| WO2015064437A1 | 2015-05-07 |
Foreign References:
| JP2007096159A | 2007-04-12 | |||
| JP2009141233A | 2009-06-25 | |||
| JPH065998A | 1994-01-14 | |||
| JP2008160750A | 2008-07-10 | |||
| JP2005303778A | 2005-10-27 | |||
| JP2009141233A | 2009-06-25 | |||
| JP2007096159A | 2007-04-12 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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