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Title:
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/149168
Kind Code:
A1
Abstract:
A circuit component according to the present invention is provided with a magnetic material layer, a first insulating layer, a second insulating layer and a wiring line. The first insulating layer is arranged on one side in the thickness direction with respect to the magnetic material layer, and the second insulating layer is arranged on the other side in the thickness direction with respect to the magnetic material layer. The wiring line comprises: a first wiring layer that is positioned between the magnetic material layer and the first insulating layer; a second wiring layer that is positioned on the other side in the thickness direction with respect to the second insulating layer; and a first penetrating wiring part that penetrates through the magnetic material layer and the second insulating layer, while being connected to the first wiring layer and the second wiring layer. The first wiring layer, the second wiring layer and the first penetrating wiring part constitute a winding wire part.

Inventors:
MIYAZAKI TATSUYA (JP)
FUJI KAZUNORI (JP)
OKAWAUCHI YUTA (JP)
Application Number:
PCT/JP2023/000779
Publication Date:
August 10, 2023
Filing Date:
January 13, 2023
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01F17/00; H01F17/04; H01F41/04; H05K1/16; H05K3/46
Domestic Patent References:
WO2014038706A12014-03-13
WO2018047486A12018-03-15
WO2015133361A12015-09-11
WO2016111282A12016-07-14
WO2006123467A12006-11-23
WO2017135057A12017-08-10
Foreign References:
JP2019204835A2019-11-28
JP2017103360A2017-06-08
JP2002344106A2002-11-29
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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