Title:
CIRCUIT COMPONENT AND PRODUCTION METHOD FOR CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/201154
Kind Code:
A1
Abstract:
Provided is a circuit component that makes it possible to achieve both high heat dissipation and high circuit wiring adhesion. A circuit component that includes a metal member, an insulating resin layer that is formed on the metal member, circuit wiring that includes a plating film that is formed on the insulating resin layer, and a mounted component that is mounted on the circuit wiring and electrically connected to the circuit wiring. A plurality of blind holes that are filled with the plating film are formed in the surface of the insulating resin layer in a wiring region in which the circuit wiring is formed. The ratio d/D of the depth d of the blind holes to the width D of the blind holes is 0.5–5.
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Inventors:
KITO AKIKO (JP)
YUSA ATSUSHI (JP)
KITAMURA TOSHIYUKI (JP)
YUSA ATSUSHI (JP)
KITAMURA TOSHIYUKI (JP)
Application Number:
PCT/JP2021/013987
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
Assignee:
MAXELL LTD (JP)
SANKEI GIKEN KOGYO CO LTD (JP)
SANKEI GIKEN KOGYO CO LTD (JP)
International Classes:
C25D7/00; C23C18/20; C23C18/22; H05K1/02; H05K3/00; H05K3/38
Domestic Patent References:
| WO2019172405A1 | 2019-09-12 |
Foreign References:
| JPH07188935A | 1995-07-25 | |||
| JP2006120840A | 2006-05-11 | |||
| US20170009974A1 | 2017-01-12 |
Attorney, Agent or Firm:
KAWAKITA Kijuro et al. (JP)
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