Title:
CIRCUIT CONFIGURATION
Document Type and Number:
WIPO Patent Application WO/2021/153373
Kind Code:
A1
Abstract:
Disclosed is a circuit configuration having a novel structure which is capable of promoting dissipation of heat from a heat-generating component through a shorter heat-transfer path and more reliably, and with which it is possible to construct a heat-transfer structure in a smaller number of assembly steps. A circuit structure 10 comprises: a plurality of heat-generating components 16 that generate heat when energized; a plurality of busbars 112, 114 respectively connected to connecting portions 30a, 30b of the plurality of heat-generating components 16; a case 28 accommodating the plurality of heat-generating components 16 and the plurality of busbars 112, 114; a plurality of heat-dissipating portions 112b, 114b respectively included in the plurality of busbars 112, 114; and a heat-conduction member 118 in thermal contact with an object 120 for heat dissipation and all of the plurality of heat-dissipating portions 112b, 114b.
Inventors:
FUJIMURA YUKI (JP)
TAKEDA HITOSHI (JP)
TAKEDA HITOSHI (JP)
Application Number:
PCT/JP2021/001832
Publication Date:
August 05, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; H05K7/06; H02G3/16
Foreign References:
| JP2005268648A | 2005-09-29 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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