Title:
CIRCUIT CONNECTION MATERIAL AND METHOD FOR PRODUCING MOUNTED UNIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/129438
Kind Code:
A1
Abstract:
Provided are a circuit connection material having excellent blocking resistance and excellent connection reliability, and a method for producing a mounted unit using the same. Elastic particles having a compression recovery rate of 50% or greater and conductive particles are dispersed in an adhesive composition comprising a film-forming resin, a radical polymerizable resin, and a radical polymerization initiator. Because the elastic particles have flexibility that allows for displacement of 50% or greater, optimal pressure can be applied to the conductive particles during pressing, and therefore, high connection reliability can be obtained. Moreover, because the compression recovery rate of the elastic particles is 50% or greater, the squeeze pressure that is generated by squeezing on a reel can be alleviated and blocking can be prevented.
Inventors:
HAMACHI HIROSHI (JP)
Application Number:
PCT/JP2013/055045
Publication Date:
September 06, 2013
Filing Date:
February 27, 2013
Export Citation:
Assignee:
DEXERIALS CORP (JP)
HAMACHI HIROSHI (JP)
HAMACHI HIROSHI (JP)
International Classes:
C09J201/00; C09J7/10; C09J9/02; C09J11/04; C09J11/06; H01L21/60
Domestic Patent References:
| WO2007058159A1 | 2007-05-24 |
Foreign References:
| JP2003249287A | 2003-09-05 | |||
| JP2010183049A | 2010-08-19 | |||
| JP2004043602A | 2004-02-12 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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Claims: