Title:
CIRCUIT CONNECTION MATERIAL, CONNECTION METHOD USING SAME, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/042632
Kind Code:
A1
Abstract:
Provided is a circuit connection material that, while suppressing fluctuations in the resistance value between circuit electrodes when subjected to high-temperature, high-humidity processing, is able to evince superior connection reliability by increasing the adhesion with the interface to a silicon nitride film. By being interposed between a pair of circuit members disposed in a manner so that the circuit electrodes face each other, the circuit connection material electrically and mechanically connects the opposing circuit members. The circuit connection material contains: (1) a polyfunctional (meth)acrylate monomer; (2) a curing agent that generates free radicals by means of heat or light; and (3) a reactive acrylic polymer that has an ethylenic unsaturated group in a side chain and has 1000-12000 double bond equivalents.
Inventors:
HAYASHI SHINICHI (JP)
Application Number:
PCT/JP2012/073695
Publication Date:
March 28, 2013
Filing Date:
September 14, 2012
Export Citation:
Assignee:
DEXERIALS CORP (JP)
HAYASHI SHINICHI (JP)
HAYASHI SHINICHI (JP)
International Classes:
C09J133/00; C08F2/44; C08F299/00; C09J11/06; H01L21/60; H05K1/14
Domestic Patent References:
WO2009113216A1 | 2009-09-17 |
Foreign References:
JP2006199824A | 2006-08-03 | |||
JP2003261838A | 2003-09-19 | |||
JP2010270293A | 2010-12-02 | |||
JPH0853655A | 1996-02-27 | |||
JPS61101582A | 1986-05-20 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
Download PDF:
Claims: