Title:
CIRCUIT CONNECTION MATERIAL AND CIRCUIT CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/001900
Kind Code:
A1
Abstract:
Disclosed is a circuit connection material which is interposed between opposing circuit electrodes so as to electrically connect opposing electrodes in the direction of pressure when pressure is applied to the circuit electrodes. The circuit connection material comprises an adhesive component, first electroconductive particles having a surface at least partially covered with an insulating covering material, and second electroconductive particles having a surface at least partially covered with Ni, an alloy or oxide of Ni, or a metal having a Vickers hardness of not less than 300 Hv, the second electroconductive particles having protrusions. The ratio of the number of first electroconductive particles to the number of second electroconductive particles (number of first electroconductive particles/number of second electroconductive particles) is 0.4 to 3.
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Inventors:
TATSUZAWA TAKASHI (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
Application Number:
PCT/JP2009/061974
Publication Date:
January 07, 2010
Filing Date:
June 30, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TATSUZAWA TAKASHI (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
TATSUZAWA TAKASHI (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
International Classes:
H01B1/22; C09J7/00; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01B1/00; H01L21/60; H01R11/01; H05K1/14
Domestic Patent References:
| WO2007099965A1 | 2007-09-07 | |||
| WO2008053873A1 | 2008-05-08 |
Foreign References:
| JP2005216753A | 2005-08-11 | |||
| JP2005044773A | 2005-02-17 | |||
| JPH0436902A | 1992-02-06 | |||
| JPH0371570A | 1991-03-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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