Title:
CIRCUIT CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2008/053873
Kind Code:
A1
Abstract:
A circuit connection structure capable of achieving an excellent electrical
connection between opposed circuit electrodes and sufficiently enhancing
the long-term reliability of the electrical characteristic between the circuit
electrodes. A circuit connection structure (1) comprises a first circuit member
(30) in which a first circuit electrode (32) is formed on a main surface (31a) of
a first circuit board (31), a second circuit member (40) in which a second circuit
electrode (42) is formed on a main surface (41a) of a second circuit board (41),
and a circuit connection member (10) which contains an adhesive composition
and conductive particles (12) and is provided between the main surface of the
first circuit member (30) and the main surface of the second circuit member (40)
so as to electrically connect the first and second circuit electrodes (32, 42).
The first and second circuit electrodes (32, 42) have a thicknesses of 50 nm or
more. A plurality of projections (14) are arranged on the surface side of the conductive
particles (12). The outermost layer is formed by nickel or nickel alloy.
Inventors:
KOJIMA KAZUYOSHI (JP)
KOBAYASHI KOUJI (JP)
ARIFUKU MOTOHIRO (JP)
MOCHIZUKI NICHIOMI (JP)
KOBAYASHI KOUJI (JP)
ARIFUKU MOTOHIRO (JP)
MOCHIZUKI NICHIOMI (JP)
Application Number:
PCT/JP2007/071090
Publication Date:
May 08, 2008
Filing Date:
October 30, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KOJIMA KAZUYOSHI (JP)
KOBAYASHI KOUJI (JP)
ARIFUKU MOTOHIRO (JP)
MOCHIZUKI NICHIOMI (JP)
KOJIMA KAZUYOSHI (JP)
KOBAYASHI KOUJI (JP)
ARIFUKU MOTOHIRO (JP)
MOCHIZUKI NICHIOMI (JP)
International Classes:
H01L21/60; H01B1/00; H01B1/22; H01B5/16; H05K1/14
Foreign References:
| JP2005166438A | 2005-06-23 | |||
| JP2002324427A | 2002-11-08 | |||
| JP2006228474A | 2006-08-31 | |||
| JP2000171823A | 2000-06-23 | |||
| JPS59120436A | 1984-07-12 | |||
| JPS60191228A | 1985-09-28 | |||
| JPH01251787A | 1989-10-06 | |||
| JPH0790237A | 1995-04-04 | |||
| JP2001189171A | 2001-07-10 | |||
| JP2005166438A | 2005-06-23 |
Other References:
MOCHIZUKI ET AL., HYOUMEN GIJUTSU, vol. 48, no. 4, 1997, pages 429 - 432
OGIWARA ET AL., AMORPHOUS PLATINGS, vol. 36, 1994, pages 35 - 37
OGIWARA ET AL., INSTITUTE OF CIRCUIT MOUNTING, vol. 10, no. 3, 1995, pages 148 - 152
See also references of EP 2081222A4
OGIWARA ET AL., AMORPHOUS PLATINGS, vol. 36, 1994, pages 35 - 37
OGIWARA ET AL., INSTITUTE OF CIRCUIT MOUNTING, vol. 10, no. 3, 1995, pages 148 - 152
See also references of EP 2081222A4
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6, Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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