Title:
CIRCUIT DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/061603
Kind Code:
A1
Abstract:
Provided is a circuit device manufacturing method wherein a resin sealing step of thinly sealing the rear surface of a circuit board with a resin is performed at low cost, said circuit board having circuit elements mounted on the upper surface thereof.
In the present invention, the upper surface and the side surfaces of a circuit board (14) are coated with a first sealing resin (18) that is formed by transfer molding, said upper surface having a hybrid integrated circuit mounted thereon, then, the lower surface of the circuit board (14), and the lower surface and the side surfaces of the first sealing resin (18) are coated with a second sealing resin (20). Furthermore, in a step of forming the second sealing resin (20), stable transfer molding is performed by fixing the position by having the upper surface of the first sealing resin (18) in contact with the inner wall of a second molding die (50).
Inventors:
SAKAMOTO HIDEYUKI (JP)
ANDO MAMORU (JP)
ANDO MAMORU (JP)
Application Number:
PCT/JP2012/006873
Publication Date:
May 02, 2013
Filing Date:
October 26, 2012
Export Citation:
Assignee:
SEMICONDUCTOR COMPONENTS IND (US)
SAKAMOTO HIDEYUKI (JP)
ANDO MAMORU (JP)
SAKAMOTO HIDEYUKI (JP)
ANDO MAMORU (JP)
International Classes:
H01L21/56
Foreign References:
| JPH0825860A | 1996-01-30 | |||
| JPH1022435A | 1998-01-23 |
Attorney, Agent or Firm:
OKADA, YOSHITAKA (JP)
Yoshiaki Okada (JP)
Yoshiaki Okada (JP)
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