Title:
CIRCUIT DEVICE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/039787
Kind Code:
A1
Abstract:
This circuit device (105) comprises: a core (10); a first circuit substrate (15); a second circuit substrate (16); a heat dissipating member (60); a first heat transfer member (50); and a second heat transfer member (51). The first circuit substrate (15) includes a first coil pattern (20) that surrounds at least a portion of the core (10). The second circuit substrate (16) includes a second coil pattern (21) that surrounds at least a portion of the core (10). The first heat transfer member (50) makes surface-to-surface contact with the first circuit substrate (15) and the heat dissipating member (60). The second heat transfer member (51) makes surface-to-surface contact with the first circuit substrate (15) and the second circuit substrate (16).
Inventors:
FUJII KENTA (JP)
KUMAGAI TAKASHI (JP)
FUKUDA TOMOHITO (JP)
HIRATSUKA TAKASHI (JP)
AOKI KOICHI (JP)
KUMAGAI TAKASHI (JP)
FUKUDA TOMOHITO (JP)
HIRATSUKA TAKASHI (JP)
AOKI KOICHI (JP)
Application Number:
PCT/JP2019/027514
Publication Date:
February 27, 2020
Filing Date:
July 11, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K1/16; H01F17/00; H01F27/02; H02M3/28; H05K1/02; H05K7/20
Domestic Patent References:
| WO2016163130A1 | 2016-10-13 | |||
| WO2017126357A1 | 2017-07-27 |
Foreign References:
| JP2016165176A | 2016-09-08 | |||
| JPH0869935A | 1996-03-12 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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