Title:
CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/039114
Kind Code:
A1
Abstract:
A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).
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Inventors:
SHIBASAKI TAKASHI (JP)
SAITO HIDEFUMI (JP)
MAKINO TAKAHISA (JP)
SHIMIZU MASANORI (JP)
SASAKI DAISUKE (JP)
SAITO HIDEFUMI (JP)
MAKINO TAKAHISA (JP)
SHIMIZU MASANORI (JP)
SASAKI DAISUKE (JP)
Application Number:
PCT/JP2011/005209
Publication Date:
March 29, 2012
Filing Date:
September 15, 2011
Export Citation:
Assignee:
ON SEMICONDUCTOR TRADING LTD
SHIBASAKI TAKASHI (JP)
SAITO HIDEFUMI (JP)
MAKINO TAKAHISA (JP)
SHIMIZU MASANORI (JP)
SASAKI DAISUKE (JP)
SHIBASAKI TAKASHI (JP)
SAITO HIDEFUMI (JP)
MAKINO TAKAHISA (JP)
SHIMIZU MASANORI (JP)
SASAKI DAISUKE (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Foreign References:
| JP2010086995A | 2010-04-15 | |||
| JP2009141229A | 2009-06-25 | |||
| JPH10189864A | 1998-07-21 | |||
| JP2009071064A | 2009-04-02 |
Attorney, Agent or Firm:
OKADA, KEI (JP)
Takashi Okada (JP)
Takashi Okada (JP)
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Claims: