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Patent Searching and Data


Title:
CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/183850
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a technique enabling design changes in connecting parts of a circuit to be accommodated easily. This circuit device is provided with a stacked body and a plurality of terminals, wherein: the stacked body includes a plurality of layers; a plurality of holes penetrating through the plurality of layers are formed in the stacked body; each of the plurality of layers includes a connecting member formed from a conductor; the connecting members each include a plurality of connecting portions provided in positions corresponding to each of the plurality of holes, and linking portions linking the plurality of connecting portions together; the plurality of terminals include a plurality of types of terminals corresponding respectively to the plurality of layers; and each of the plurality of types of terminals can be connected selectively to the connecting portion of one corresponding layer among the plurality of layers by being inserted into an arbitrarily defined hole among the plurality of holes.

Inventors:
KIKUTA TAKAMUNE (JP)
Application Number:
JP2019/049862
Publication Date:
September 17, 2020
Filing Date:
December 19, 2019
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R29/00; H01R31/08; H01R11/01
Foreign References:
JP2018116767A2018-07-26
JP2004030993A2004-01-29
JPH04134075U1992-12-14
US7963776B12011-06-21
JPS5177594U1976-06-18
US4054939A1977-10-18
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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