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Title:
CIRCUIT FILM MATERIAL, METHOD FOR MANUFACTURING CIRCUIT FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/145994
Kind Code:
A1
Abstract:
A circuit film material (400a) is provided with a film base material (401), first and second side-wiring (402, 403), an IC chip (404), input-side center wiring (405), and output-side center wiring (406). A first non-wiring region (407) linearly extending from the input side of the film base material (401) toward the output side of the film base material (401) is provided between the first side-wiring (402), and the input-side center wiring (405), IC chip (404) and output-side center wiring (406). A second non-wiring region (408) linearly extending from the input side of the film base material (401) toward the output side of the film base material (401) is provided between the second side-wiring (403), and the input-side center wiring (405), IC chip (404), and output-side center wiring (406).

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Inventors:
NAKAMINAMI HIROAKI (JP)
Application Number:
PCT/JP2018/001935
Publication Date:
August 01, 2019
Filing Date:
January 23, 2018
Export Citation:
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Assignee:
SAKAI DISPLAY PRODUCTS CORP (JP)
International Classes:
G09F9/00; G02F1/1345; G09F9/30
Domestic Patent References:
WO2016051681A12016-04-07
WO2014077175A12014-05-22
Foreign References:
US20140104252A12014-04-17
JP2001109435A2001-04-20
JP2003243460A2003-08-29
JPH0961118A1997-03-07
US20160147105A12016-05-26
US20050083474A12005-04-21
JP2000077484A2000-03-14
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Download PDF:
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