Title:
CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/012626
Kind Code:
A1
Abstract:
A circuit formation method, including: a wiring formation step for applying a metal-containing liquid containing nanometer-sized metal microparticles onto a base and firing the metal-containing liquid to form wiring; a paste application step for applying a resin paste containing micrometer-sized metal particles so as to be connected to the wiring formed in the wiring formation step; and a component placement step for placing a component having an electrode onto the base so that the electrode comes into contact with the resin paste applied in the paste application step.
Inventors:
TAKEUCHI TASUKU (JP)
TOMINAGA RYOJIRO (JP)
SAKAKIBARA RYO (JP)
TOMINAGA RYOJIRO (JP)
SAKAKIBARA RYO (JP)
Application Number:
PCT/JP2018/026444
Publication Date:
January 16, 2020
Filing Date:
July 13, 2018
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K3/12; H05K1/18; H05K3/10; H05K3/32; B22F1/054
Foreign References:
| JP2002057423A | 2002-02-22 | |||
| JP2006216735A | 2006-08-17 | |||
| JP2014017364A | 2014-01-30 | |||
| JP2001143529A | 2001-05-25 | |||
| JP2004241514A | 2004-08-26 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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