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Patent Searching and Data


Title:
CIRCUIT MEMBER-CONNECTING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2017/090440
Kind Code:
A1
Abstract:
Provided is a circuit member-connecting resin sheet made of a film-shaped resin composition which is interposed between facing electrodes and electrically connects the facing electrodes, the resin sheet being characterized in that the cured product of the resin composition has a glass transition temperature of 150-350°C and an average linear expansion coefficient of 45 ppm or less at a temperature of 0-130°C. According to this circuit member-connecting resin sheet, the connection resistance is unlikely to change at joints connecting circuit members to each other, and high reliability is achieved.

Inventors:
NEZU YUSUKE (JP)
SUGINO TAKASHI (JP)
TSUCHIYA KAZUHIRO (JP)
Application Number:
PCT/JP2016/083335
Publication Date:
June 01, 2017
Filing Date:
November 10, 2016
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/60; C09J7/10; C09J159/00; C09J167/00
Domestic Patent References:
WO2013125684A12013-08-29
Foreign References:
JP2011047084A2011-03-10
JP2013187242A2013-09-19
JP2014165206A2014-09-08
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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