Title:
CIRCUIT MODULE, LIGHT-EMITTING MODULE, AND PRESSING MEMBER
Document Type and Number:
WIPO Patent Application WO/2015/056567
Kind Code:
A1
Abstract:
In a circuit module, an element-mounting substrate (20) has a mounting portion on which a semiconductor light-emitting element is mounted, and an electrode portion (20b) through which current is supplied to the semiconductor light-emitting element. An FPC substrate has a conductive portion (22a1) through which current supplied to the electrode portion (20b) flows. A flat spring (24) has pressing portions (24a2) for pressing the conductive portion (22a1). The conductive portion (22a1) contacts the electrode portion (20b) by being sandwiched between the electrode portion (20b) and the pressing portions (24a2). The flat spring (24) may be a plate-shaped member having openings for exposing the mounting portion.
Inventors:
SUZUKI TETSUYA (JP)
TOKIDA TSUKASA (JP)
TOKIDA TSUKASA (JP)
Application Number:
PCT/JP2014/076269
Publication Date:
April 23, 2015
Filing Date:
October 01, 2014
Export Citation:
Assignee:
KOITO MFG CO LTD (JP)
International Classes:
F21V19/00; H01L23/48; H01L33/62; F21Y101/02
Foreign References:
| JP2012004420A | 2012-01-05 | |||
| JP2012230771A | 2012-11-22 | |||
| JP2006184352A | 2006-07-13 |
Attorney, Agent or Firm:
MORISHITA SAKAKI (JP)
Sakaki Morishita (JP)
Sakaki Morishita (JP)
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