Title:
CIRCUIT MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/198856
Kind Code:
A1
Abstract:
A circuit module (101) is provided with: a wiring board (1) having a main surface (1u); an electronic component (3) mounted on the main surface (1u); and a sealing resin (4) that covers, on the main surface (1u), at least a part of the electronic component (3). A recess (7) is formed at least in a part of a side surface (11) of the sealing resin (4), and at least the recess (7) is covered with a conductive film (6).
Inventors:
OKADA TAKAHIRO (JP)
SATO KAZUSHIGE (JP)
KANNO TAKAFUMI (JP)
AMACHI NOBUMITSU (JP)
SATO KAZUSHIGE (JP)
KANNO TAKAFUMI (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2018/015699
Publication Date:
November 01, 2018
Filing Date:
April 16, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/28; H01L21/56; H01L23/00
Domestic Patent References:
| WO2017212965A1 | 2017-12-14 |
Foreign References:
| JP2012256842A | 2012-12-27 | |||
| JP2001244688A | 2001-09-07 | |||
| JP2011258920A | 2011-12-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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