Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2011/136099
Kind Code:
A1
Abstract:
Disclosed is a circuit module, the purpose whereof is to minimize unwanted interference that arises between signals of a plurality of types, said circuit module comprising a splitter (110) and a circuit substrate (10). A signal line (SL1) connects an external electrode (14a) and an external electrode (16a). A signal line (SL2) connects an external electrode (14b) and an external electrode (16b). A signal line (SL3) connects an external electrode (14c) and an external electrode (16c). A grounding line (GL1) connects the external electrode (14e) and an external electrode (16d). A grounding line (GL2) is connected to the external electrode (14d), and is capacitive coupled to the signal line (SL2).
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Inventors:
YAMANE TAKASHI (JP)
IKADA KATSUHIRO (JP)
HIRANO YASUHIKO (JP)
IKADA KATSUHIRO (JP)
HIRANO YASUHIKO (JP)
Application Number:
PCT/JP2011/059697
Publication Date:
November 03, 2011
Filing Date:
April 20, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
YAMANE TAKASHI (JP)
IKADA KATSUHIRO (JP)
HIRANO YASUHIKO (JP)
YAMANE TAKASHI (JP)
IKADA KATSUHIRO (JP)
HIRANO YASUHIKO (JP)
International Classes:
H03H7/46; H03H9/72; H04B1/38
Domestic Patent References:
| WO2009104251A1 | 2009-08-27 | |||
| WO2009025106A1 | 2009-02-26 |
Foreign References:
| JP2010068079A | 2010-03-25 | |||
| JP2006217279A | 2006-08-17 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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Claims: