Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/061938
Kind Code:
A1
Abstract:
This circuit module (100) includes: a substrate element body (11) provided with semi-cylindrical recessed parts on side surfaces thereof; connection electrodes (12) provided on internal walls of the recessed parts; a circuit substrate (10) including first lands (13) and a wiring (15); an electronic component (31) connected to the first lands (13); and a shield case (90) having the electronic component (31) disposed thereinside. The first lands (13) and the connection electrodes (12) are connected by the wiring (15). The shield case (90) is provided with an opening (93) formed in a wall surface (92), and a first planar member (94A) connected to an edge portion of the opening (93) while folded with respect to the wall surface. The wall surface (92) and the first planar member (94A) of the shield case (90) are connected to one principal surface of the substrate element body (11) such that the edge portion of the opening (93) and the first planar member (94A) do not come into contact with the wiring.
Inventors:
MIWA HIDEYUKI (JP)
AMACHI NOBUMITSU (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2017/033936
Publication Date:
April 05, 2018
Filing Date:
September 20, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K9/00; H01L23/02
Foreign References:
| JP2001308235A | 2001-11-02 | |||
| JP2002026163A | 2002-01-25 | |||
| JP2004319849A | 2004-11-11 | |||
| JP2005303110A | 2005-10-27 | |||
| JP2006041272A | 2006-02-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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