Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/123382
Kind Code:
A1
Abstract:
A circuit module (101) is provided with: a substrate (1) having a main surface (1a); a first component (6) mounted on the main surface (1a); and a sealing resin section (3) that covers at least the side surface of the first component (6), while covering the main surface (1a). The first component (6) has a hollow section (6c), and the first component (6) is provided with a connecting section (6b) exposed to the hollow section (6c). The sealing resin section (3) is disposed on an area excluding at least a part of an upper surface region of the first component (6), said upper surface region corresponding to the hollow section (6c).
Inventors:
OKADA KEN (JP)
SATO KAZUSHIGE (JP)
FUNAKAWA SHINGO (JP)
FUJIKAWA KATSUHIKO (JP)
AMACHI NOBUMITSU (JP)
SATO KAZUSHIGE (JP)
FUNAKAWA SHINGO (JP)
FUJIKAWA KATSUHIKO (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2017/042218
Publication Date:
July 05, 2018
Filing Date:
November 24, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/31; H01L25/00; H03H9/25
Domestic Patent References:
| WO2014080931A1 | 2014-05-30 | |||
| WO2013146374A1 | 2013-10-03 |
Foreign References:
| JP2009033333A | 2009-02-12 | |||
| JP2003115563A | 2003-04-18 | |||
| JP2001243437A | 2001-09-07 | |||
| JP2017175427A | 2017-09-28 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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