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Patent Searching and Data


Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/180939
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a circuit module in which it is possible to reduce wraparound of noise due to a shield layer, and to improve isolation characteristics between electronic components, while suppressing emission of noise to the outside and infiltration of noise from the outside. A circuit module (100) comprises: electronic components (30); a plurality of conductor posts (40); a mold layer (50) for sealing the plurality of electronic components (30) and the plurality of conductor posts (40); and a shield layer (60) on the mold layer (50). The electronic components (30) include a first electronic component (31) and second electronic components (32, 36). The plurality of conductor posts (40) include a conductor post group (400) that crosses between the first electronic component (31) and the second electronic components (32, 36). For each conductor post (40) of the conductor post group (400), in plan view, the shield layer (60) has a slit (600) extending through between the conductor post (40) and the first electronic component (31), or between the conductor post (40) and the second electronic components (32, 36).

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Inventors:
NAKAJIMA REIJI
Application Number:
PCT/JP2018/011572
Publication Date:
October 04, 2018
Filing Date:
March 23, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/28; H01L23/00; H05K1/02; H05K3/28; H05K9/00
Foreign References:
US20120044653A12012-02-23
US20090000114A12009-01-01
JP2013059220A2013-03-28
US20160093576A12016-03-31
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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