Title:
CIRCUIT STRUCTURE AND ELECTRICAL CONNECTION BOX
Document Type and Number:
WIPO Patent Application WO/2020/246224
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology for enabling enhancement of effective heat dissipation in a circuit board. This circuit structure is provided with a circuit board on which a heat generation component is mounted, a heat dissipation member that is to be stacked on the circuit board, a metal member attached to the circuit board, wherein: the circuit board has a hole formed, in an electric conductive path connected to the heat generation component, at a position away from the heat generation component; and the metal member includes an insertion part inserted into the hole, and a protrusion part connected to one end of the insertion part and that protrudes from the hole toward the heat dissipation member.
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Inventors:
KITA YUKINORI (JP)
Application Number:
PCT/JP2020/019580
Publication Date:
December 10, 2020
Filing Date:
May 18, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L23/12; H01L23/36; H02G3/16; H05K1/02; H05K7/20
Domestic Patent References:
| WO2018193828A1 | 2018-10-25 |
Foreign References:
| JP2014127522A | 2014-07-07 | |||
| JP2018182147A | 2018-11-15 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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