Title:
CIRCUIT STRUCTURE AND ELECTRICAL JUNCTION BOX
Document Type and Number:
WIPO Patent Application WO/2019/116880
Kind Code:
A1
Abstract:
This circuit structure 20 is provided with: a substrate 21 which comprises a conductive path 22, while being provided with a thermally conductive heat transfer part 29 that penetrates therethrough in the plate thickness direction; a substrate 21; a semiconductor package 30 which is mounted on the substrate 21 and comprises a chip 31, a resin part 35 that covers the chip 31, a first lead part 32 that is connected to the chip 31, while being exposed on the substrate 21 side with respect to the resin part 35, and a second lead part 33 that is connected to the chip 31, while being exposed on a side opposite to the substrate 21 side with respect to the resin part 35; a heat dissipation member 40 which is arranged on a side opposite to the semiconductor package 30 side with respect to the substrate 21, and which is connected to the heat transfer part 29 in a heat transferring manner; and a conductive member 50 which connects the second lead part 33 and the heat transfer part 29 to each other.
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Inventors:
UCHIDA KOKI (JP)
Application Number:
PCT/JP2018/043503
Publication Date:
June 20, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L23/29; H01L23/36; H05K7/20
Foreign References:
| JPH10284654A | 1998-10-23 | |||
| JP2010161131A | 2010-07-22 | |||
| JP2010219569A | 2010-09-30 | |||
| JP2016111117A | 2016-06-20 | |||
| JP2002043779A | 2002-02-08 | |||
| JPH1154673A | 1999-02-26 | |||
| JPS4863244U | 1973-08-11 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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