Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/167081
Kind Code:
A1
Abstract:
Provided is a circuit structure in which wires are less prone to breaking due to a change in the shape of a resin molding. A circuit structure (1) is provided with: an electronic component (3) having electrodes (31, 32); a resin molding (2) in which the electrode component (3) is embedded; and wires (41, 42) connected to the electrodes (31, 32). A groove (21) is formed around the electronic component (3) in the resin molding (2). The wires (41, 42) are provided so as to pass through the groove (21) interior.
Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2016/058891
Publication Date:
October 20, 2016
Filing Date:
March 22, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01L23/12; H01L21/60; H05K1/18; H05K3/00; H05K5/00
Domestic Patent References:
| WO2010140335A1 | 2010-12-09 |
Foreign References:
| JP2012089568A | 2012-05-10 | |||
| JP2006086488A | 2006-03-30 | |||
| JPS59182545A | 1984-10-17 |
Other References:
See also references of EP 3285287A4
Attorney, Agent or Firm:
MURAKAMI, TAKASHI (JP)
Murakami In addition (JP)
Murakami In addition (JP)
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