CIRCUIT STRUCTURE

WIPO Patent Application WO/2017/131044

A1

A circuit structure provided with: a circuit substrate having one surface on which a circuit pattern is formed; a plurality of bus bars constituting part of a power circuit, the bus bars being fixed to the other surface of the circuit substrate with a gap therebetween; a first terminal spanning the gap between two adjacent bus bars among the plurality of bus bars, the first terminal being electrically connected to one of the bus bars; an electronic component having a second terminal that is electrically connected to the circuit pattern of the circuit substrate; and a flexible sheet member fixed to the one bus bar, the flexible sheet member electrically connecting the second terminal and the circuit pattern while insulating the one bus bar and the second terminal. The flexible sheet member has an adhesive layer fixed to the one bus bar, a conductor foil for a terminal that electrically connects the second terminal and the circuit pattern, and an insulation layer interposed between the adhesive layer and the conductor foil for a terminal, the insulation layer insulating the one bus bar and the conductor foil for a terminal.

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CHIN TOU (JP)
NAKAMURA ARINOBU (JP)

PCT/JP2017/002580

August 03, 2017

January 25, 2017

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AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

B60R16/02; H02G3/16; H05K1/14; H05K7/06

WO2006073050A1

2006-07-13

JP2003164039A	2003-06-06
JP2002093995A	2002-03-29
JP2013206982A	2013-10-07

YAMANO, Hiroshi (JP)

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