Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/216366
Kind Code:
A1
Abstract:
This circuit structure 10 is provided with: a substrate 20 to which a heat-generating component 11 is mounted and in which through holes 22A, 22B are formed; a heat dissipation member 40 stacked on the substrate 20; and a heat transfer member 50 that is sandwiched between the substrate 20 and the heat dissipation member 40 and that transfers heat from the substrate 20 to the heat dissipation member 40. The heat transfer member 50 is in close contact with the hole walls of the through holes 22A, 22B in the substrate 20.
Inventors:
TSUCHIDA TOSHIYUKI (JP)
Application Number:
PCT/JP2019/018493
Publication Date:
November 14, 2019
Filing Date:
May 09, 2019
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; H01F30/10; H02M7/48; H05K1/02; H05K1/18
Domestic Patent References:
| WO2015059967A1 | 2015-04-30 |
Foreign References:
| JP2016164900A | 2016-09-08 | |||
| JP2012146929A | 2012-08-02 | |||
| JPH08288432A | 1996-11-01 | |||
| JP2015060923A | 2015-03-30 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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