Title:
CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/035974
Kind Code:
A1
Abstract:
The present invention provides a preparation method of a pretreated low-Dk glass fiber fabric for forming a circuit substrate, the method comprising: pretreating a low-Dk glass fiber fabric by using a pretreatment glue solution having a Dk approximating to a Dk of said low-Dk glass fiber fabric across different temperatures and having a low Df. The present invention further provides a bonding sheet and a circuit substrate prepared by the method. The present invention enables the circuit substrate prepared by the circuit substrate preparation method to have a small Dk difference between a warpwise direction and a weftwise direction, thereby effectively addressing an issue of signal time delay, and to have a low Df to reduce a signal loss of the circuit substrate. Moreover, a resulting cured, partially-cured or uncured dried glue from baking the pretreatment glue solution to remove a solvent, and the low-Dk glass fiber fabric have similar dielectric properties across different temperatures, so that the circuit substrate has a considerably small signal time delay across different temperatures.
More Like This:
Inventors:
YAN SHANYIN (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
ZHU YONGMING (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
ZHU YONGMING (CN)
Application Number:
PCT/CN2015/096520
Publication Date:
March 09, 2017
Filing Date:
December 07, 2015
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
D06M15/227; D06M15/00; D06M15/53
Foreign References:
| CN103755989A | 2014-04-30 | |||
| CN101494949A | 2009-07-29 | |||
| CN102304264A | 2012-01-04 | |||
| CN101570640A | 2009-11-04 |
Other References:
See also references of EP 3342925A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF: