Title:
CLAD MATERIAL AND CLAD MATERIAL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/029299
Kind Code:
A1
Abstract:
Provided are a clad material and a clad material manufacturing method, with which a 50% or greater weight reduction can be achieved compared to pure copper material (C1020) while minimizing electrical resistance, said clad material preferably being suitable as a conductor for alternating current. This clad material is configured by layering and pressure-bonding a first copper layer, an aluminum layer, and a second copper layer in this order, and satisfies the expressions 0.5 mm≤TP≤2.0 mm, 6≤TA/TC1≤26, 6≤TA/TC2≤26, 1.0≤TC1MAX/TC1MIN≤3.0, and 1.0≤TC2MAX/TC2MIN≤3.0, where TP is the average total thickness, TA is the average thickness of the aluminum layer, TC1 is the average thickness of the first copper layer, TC1MAX is the maximum thickness and TC1MIN is the minimum thickness of the first copper layer in the measurement range for the average thickness TC1, TC2 is the average thickness of the second copper layer, and TC2MAX is the maximum thickness and TC2MIN is the minimum thickness of the second copper layer in the measurement range for the average thickness TC2.
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Inventors:
IWAMA SHOHEI (JP)
HARA YUYA (JP)
KODAMA KENJI (JP)
HARA YUYA (JP)
KODAMA KENJI (JP)
Application Number:
PCT/JP2023/025821
Publication Date:
February 08, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
PROTERIAL LTD (JP)
International Classes:
B21B1/22; B21B3/00; B23K20/04; B32B15/01
Domestic Patent References:
| WO2018147297A1 | 2018-08-16 |
Foreign References:
| JP2013143257A | 2013-07-22 | |||
| CN104498780A | 2015-04-08 | |||
| KR20160129564A | 2016-11-09 | |||
| US20040137260A1 | 2004-07-15 | |||
| CN202217544U | 2012-05-09 |
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