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Title:
CLADDING MATERIAL AND CASING FOR ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2017/115661
Kind Code:
A1
Abstract:
This cladding material (10) is provided with: a first layer (11) that is configured from an Mg-Li-based alloy; a second layer (12) that is configured from an Al-based alloy; and a first junction part (13) which is configured from a Cu-based alloy and is positioned on the junction interface (Ia) between the first layer and the second layer when viewed in cross section in the thickness direction. This cladding material has a specific gravity of 2.10 or less.

Inventors:
YAMAMOTO SHINJI (JP)
INOUE RYOJI (JP)
Application Number:
PCT/JP2016/087352
Publication Date:
July 06, 2017
Filing Date:
December 15, 2016
Export Citation:
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Assignee:
HITACHI METALS LTD (JP)
International Classes:
B32B15/01; B23K20/00; B23K20/04; C22C23/00; H05K5/02; C22F1/00; C22F1/04; C22F1/06
Domestic Patent References:
WO2011155214A12011-12-15
Foreign References:
JP2015202680A2015-11-16
JPH06328617A1994-11-29
JP2014013467A2014-01-23
JP2005281824A2005-10-13
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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