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Patent Searching and Data


Title:
CLAMP UNIT
Document Type and Number:
WIPO Patent Application WO/2019/064336
Kind Code:
A1
Abstract:
A clamp unit U is provided with a jig 100 for attaching a substrate P to which an electronic component 5 is mounted, and a clamp device 50 which clamps the substrate P via the jig 100. The jig 100 is provided with a base 110 for attaching the substrate P, and an annular ring member 120 fixed to a lower surface of the base 110. The ring member 120 has groove portions 125A to 125C in at least two equally divided positions in a circumferential direction of an inner surface 121. The clamp device 50 is provided with a cylinder body 51 and lock member 65A to 65C having a nail portion 67 that, when moved in a radial direction of the cylinder body 51 due to an air pressure supplied to the cylinder body 51, locks onto the groove portions 125A to 125C. The groove portions 125A to 125C have a shape inclined at a predetermined angle in the radial direction with respect to an axis Lo of the cylinder body 65. The nail portion 67 has a shape inclined at the predetermined angle in the radial direction, similarly to the groove portions 125A to 125C.

Inventors:
KISHIDA AKIRA (JP)
Application Number:
PCT/JP2017/034701
Publication Date:
April 04, 2019
Filing Date:
September 26, 2017
Export Citation:
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Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/04
Domestic Patent References:
WO2017122281A12017-07-20
Foreign References:
JPH0691574A1994-04-05
JPH0957676A1997-03-04
JPH0740156A1995-02-10
JP2000271891A2000-10-03
JPS61109652U1986-07-11
JPS60193400A1985-10-01
US5988619A1999-11-23
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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