Title:
CLAMPING ASSEMBLY FOR HIGH-VOLTAGE SOLID STATE DEVICES
Document Type and Number:
WIPO Patent Application WO2004028748
Kind Code:
A3
Abstract:
A clamping assembly (200) for use in conjunction with high voltage solid state devices. The clamping assembly (200) includes a clamp frame (400) having upper (402) and lower (404) clamping plates substantially composed of aluminum and joined together by four dielectric rods (406) composed of glass laminate material. The clamping assembly (200) further includes a compression assembly (500) mounted in the upper clamping plate (402) and including several spring washers (506) disposed in a recess defined by the upper clamping plate (402). The position of a compression cap (502) attached to the upper clamping plate (402) by eight cap screws (504) can by adjusted by way of the cap screws (504) so as to compress, or deflect, the spring washers (506). The spring washers (506) in turn exert a compressive force that is a function of the spring constant k of the spring washers (506) as well as of the distance over which the spring washers (506) are compressed by the compression cap (502). The compressive force thus generated is transmitted to a pivot ball (508) seated in a recess (510A) collectively defined by the spring washers (506). A force distribution member defines a socket in which the pivot ball (508) is partially received and transmits the compressive force to a stack (300) which is disposed between the upper (402) and lower (404) clamping plates and includes semiconductor devices and heat sinks (304). The socket (510A) in the force distribution member (510) permits the force distribution member (510) to rotate with respect to the pivot ball (508) so that the compression surface (502A) of the force distribution member (510) automatically moves to a position wherein the compression surface (502A) is in substantial contact with the upper surface of the stack (300A), notwithstanding any horizontal misalignment of the stack (300). As a result of the substantial contact between the compression surface (502A) and the upper surface of the stack (300A), the compressive force is distributed substantially uniformly across the upper surface of the stack (300).
Inventors:
HITCHCOCK ROGER N
Application Number:
PCT/US2001/051599
Publication Date:
March 03, 2005
Filing Date:
October 26, 2001
Export Citation:
Assignee:
VARIAN MED SYS INC (US)
International Classes:
H01L23/473; H01L23/48; H01L25/11; (IPC1-7): H01L23/02; H01L23/34; H01L23/544; H05K7/02
Foreign References:
| US3573574A | 1971-04-06 |
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