Title:
CLAMPING SYSTEM, CLAMPING METHOD, AND CLAMPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181430
Kind Code:
A1
Abstract:
A clamping system (1A) is provided with a plate (50), a clamping device (10) for holding a workpiece (W), and a suction attachment unit (20) which causes the clamping device (10) to be suction-attached to a surface of the plate (50). Further, a clamping method comprises a step of placing the clamping device (10) on the surface of the plate (50), a step of causing the clamping device (10) to be suction-attached to the surface of the plate (50) by means of the suction attachment unit (20), and a step of sandwiching the workpiece (W) in the clamping device (10) by means of a robot arm (R). The clamping system (1A) and the clamping method provided by the present invention enable the clamping device (10) to be attached rapidly to the plate (50) in accordance with the shape of the workpiece (W).
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Inventors:
SAWADA MINORU (JP)
SHIOZAKI KEISUKE (JP)
YAMAZAKI KENJI (JP)
HAYASHI HIROKI (JP)
SHIOZAKI KEISUKE (JP)
YAMAZAKI KENJI (JP)
HAYASHI HIROKI (JP)
Application Number:
PCT/JP2019/008020
Publication Date:
September 26, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
KOMATSU NTC LTD (JP)
International Classes:
B23Q3/06; B23Q3/154
Foreign References:
| JP2004009171A | 2004-01-15 | |||
| JPH09503448A | 1997-04-08 | |||
| JP3173058U | 2012-01-19 | |||
| JP2006116612A | 2006-05-11 | |||
| JPH07124835A | 1995-05-16 | |||
| JPH0740169A | 1995-02-10 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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