Title:
CLAY-LIKE COMPOSITION FOR FORMING A SINTERED SILVER ALLOY OBJECT, POWDER FOR A CLAY-LIKE COMPOSITION FOR FORMING A SINTERED SILVER ALLOY OBJECT, METHOD FOR MANUFACTURING A CLAY-LIKE COMPOSITION FOR FORMING A SINTERED SILVER ALLOY OBJECT, SINTERED SILVER ALLOY OBJECT, AND METHOD FOR MANUFACTURING A SINTERED SILVER ALLOY OBJECT
Document Type and Number:
WIPO Patent Application WO/2011/125266
Kind Code:
A1
Abstract:
The disclosed clay-like composition for forming a sintered object and the disclosed powder for a clay-like composition for forming a sintered object contain water, a binder, and a powder component containing a silver powder and a copper oxide powder. Said composition and powder can be used to form a sintered silver object that does not readily tarnish even in air and has excellent properties such as tensile strength, flexural strength, surface hardness, and elongation.
Inventors:
YAMAJI Takashi (SANDA PLANT 12-6, Technopark, Sanda-sh, Hyogo 39, 〒6691339, JP)
山路 貴司 (〒39 兵庫県三田市テクノパーク12-6 三菱マテリアル株式会社 三田工場内 Hyogo, 〒6691339, JP)
IDO Yasuo (SANDA PLANT 12-6, Technopark, Sanda-sh, Hyogo 39, 〒6691339, JP)
山路 貴司 (〒39 兵庫県三田市テクノパーク12-6 三菱マテリアル株式会社 三田工場内 Hyogo, 〒6691339, JP)
IDO Yasuo (SANDA PLANT 12-6, Technopark, Sanda-sh, Hyogo 39, 〒6691339, JP)
Application Number:
JP2010/073698
Publication Date:
October 13, 2011
Filing Date:
December 28, 2010
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目3番2号 Tokyo, 〒1008117, JP)
YAMAJI Takashi (SANDA PLANT 12-6, Technopark, Sanda-sh, Hyogo 39, 〒6691339, JP)
山路 貴司 (〒39 兵庫県三田市テクノパーク12-6 三菱マテリアル株式会社 三田工場内 Hyogo, 〒6691339, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目3番2号 Tokyo, 〒1008117, JP)
YAMAJI Takashi (SANDA PLANT 12-6, Technopark, Sanda-sh, Hyogo 39, 〒6691339, JP)
山路 貴司 (〒39 兵庫県三田市テクノパーク12-6 三菱マテリアル株式会社 三田工場内 Hyogo, 〒6691339, JP)
International Classes:
B22F1/00; A44C27/00; B22F3/02; B22F3/10
Attorney, Agent or Firm:
SHIGA Masatake et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Download PDF:
Claims:
