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Title:
CLAY STABILIZATION IN SUB-SURFACE FORMATIONS
Document Type and Number:
WIPO Patent Application WO2005098199
Kind Code:
A3
Abstract:
Compositions and methods of using same for clay stabilization in sub-surface formation are provided. The compositions comprise an aqueous solution of a polymer such as poly(dimethylaminoethylmethacrylate methyl chloride quaternary salt). The present invention can be effectively utilized to inhibit clay swelling for treating and/or pretreating down-hole formations during well stimulation.

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Inventors:
BLAIR CECIL CURTIS (US)
Application Number:
PCT/US2005/009988
Publication Date:
May 04, 2006
Filing Date:
March 24, 2005
Export Citation:
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Assignee:
NALCO ENERGY SERVICES LP (US)
BLAIR CECIL CURTIS (US)
International Classes:
E21B43/00; C09K8/60
Foreign References:
US4588508A1986-05-13
US3549542A1970-12-22
US6262168B12001-07-17
US5342530A1994-08-30
Other References:
See also references of EP 1730384A4
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