Title:
CLEANING AGENT COMPOSITION FOR RESIN MASK DETACHMENT
Document Type and Number:
WIPO Patent Application WO/2018/047631
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cleaning agent composition for resin mask detachment having superior resin mask removal properties and little waste water treatment burden. This disclosure relates to a cleaning agent composition for resin mask detachment wherein, in an embodiment: the cleaning agent composition includes an inorganic alkali (component A), an organic solvent (component B), and water (component C); the coordinates of the Hansen solubility parameter for component B are within a range of a 1.5 MPa0.5 sphere centered on δd = 17.5, δp = 5.0, and δh = 11.5; the component C content during use of the cleaning agent composition is 85% by mass or greater; and the mass ratio (A/B) of component A to component B is 1 - 60.
Inventors:
NISHI ISAO
Application Number:
PCT/JP2017/030352
Publication Date:
March 15, 2018
Filing Date:
August 24, 2017
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
G03F7/42; B08B3/08; C11D7/04; C11D7/26; C11D17/08; H01L21/027
Domestic Patent References:
| WO2012133382A1 | 2012-10-04 |
Foreign References:
| JP2005509693A | 2005-04-14 | |||
| JP2009516360A | 2009-04-16 | |||
| JP2004157284A | 2004-06-03 | |||
| JP2004038073A | 2004-02-05 |
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (JP)
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