Title:
CLEANING AGENT COMPOSITION FOR SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD FOR CLEANING SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR DEVICES, AND SUBSTRATE FOR SEMICONDUCTOR DEVICES
Document Type and Number:
WIPO Patent Application WO/2018/169016
Kind Code:
A1
Abstract:
The present invention relates to a cleaning agent composition for a substrate for semiconductor devices, said substrate comprising at least one of a wiring line and an electrode. The wiring line and the electrode contain cobalt or a cobalt alloy; and the cleaning composition contains component (A) which is composed of at least one compound selected from the group consisting of specific compounds, and component (B) which is composed of water.
Inventors:
KUSANO TOMOHIRO (JP)
HARADA KEN (JP)
KAWASE YASUHIRO (JP)
HARADA KEN (JP)
KAWASE YASUHIRO (JP)
Application Number:
PCT/JP2018/010323
Publication Date:
September 20, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
H01L21/304; C11D1/62; C11D3/30; C11D7/32
Domestic Patent References:
| WO2016011331A1 | 2016-01-21 |
Foreign References:
| JP2008543060A | 2008-11-27 | |||
| JP2011074189A | 2011-04-14 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
Download PDF: