Title:
CLEANING AGENT FOR REMOVAL OF, REMOVAL METHOD FOR, AND CLEANING METHOD FOR WATER-SOLUBLE, LEAD-FREE SOLDER FLUX
Document Type and Number:
WIPO Patent Application WO/2011/027673
Kind Code:
A1
Abstract:
Disclosed is a cleaning agent for the removal of a water-soluble, lead-free solder flux that is capable of cleaning water-soluble flux residue, which is produced when soldering a lead-free solder with a water-soluble flux, in a short period of time, and that is provided with a superior solubility and ability to clean tight crevices. The cleaning agent for the removal of water-soluble, lead-free solder flux comprises in the range of 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.
Inventors:
TANAKA, Takashi (1-9, Tsurumi 1-chome, Tsurumi-ku, Osaka-sh, Osaka 53, 〒5380053, JP)
田中 俊 (〒53 大阪府大阪市鶴見区鶴見１丁目１番９号 荒川化学工業株式会社研究所内 Osaka, 〒5380053, JP)
TANAKA, Keita (1-9, Tsurumi 1-chome, Tsurumi-ku, Osaka-sh, Osaka 53, 〒5380053, JP)
田中 俊 (〒53 大阪府大阪市鶴見区鶴見１丁目１番９号 荒川化学工業株式会社研究所内 Osaka, 〒5380053, JP)
TANAKA, Keita (1-9, Tsurumi 1-chome, Tsurumi-ku, Osaka-sh, Osaka 53, 〒5380053, JP)
Application Number:
JP2010/064088
Publication Date:
March 10, 2011
Filing Date:
August 20, 2010
Export Citation:
Assignee:
ARAKAWA CHEMICAL INDUSTRIES, LTD. (3-7 Hiranomachi 1-chome, Chuo-ku Osaka-sh, Osaka 46, 〒5410046, JP)
荒川化学工業株式会社 (〒46 大阪府大阪市中央区平野町１丁目３番７号 Osaka, 〒5410046, JP)
TANAKA, Takashi (1-9, Tsurumi 1-chome, Tsurumi-ku, Osaka-sh, Osaka 53, 〒5380053, JP)
田中 俊 (〒53 大阪府大阪市鶴見区鶴見１丁目１番９号 荒川化学工業株式会社研究所内 Osaka, 〒5380053, JP)
荒川化学工業株式会社 (〒46 大阪府大阪市中央区平野町１丁目３番７号 Osaka, 〒5410046, JP)
TANAKA, Takashi (1-9, Tsurumi 1-chome, Tsurumi-ku, Osaka-sh, Osaka 53, 〒5380053, JP)
田中 俊 (〒53 大阪府大阪市鶴見区鶴見１丁目１番９号 荒川化学工業株式会社研究所内 Osaka, 〒5380053, JP)
International Classes:
C11D7/26; B08B3/08; C11D7/16; C11D7/32; C23G5/036
Attorney, Agent or Firm:
Saegusa & Partners (Kitahama TNK Building, 1-7-1 Doshomachi, Chuo-ku, Osaka-sh, Osaka 45, 〒5410045, JP)