CLEANING AGENT FOR REMOVING SOLDER FLUX AND METHOD FOR CLEANING SOLDER FLUX

WIPO Patent Application WO/2005/021700

A1

Disclosed is a cleaning agent exhibiting excellent cleaning performance even in cleaning of a flux for lead-free solders or a flux for high-melting-point solders and further exhibiting excellent rinsing characteristics in the following rinsing step wherein an alcohol solvent is used. Also disclosed is a method for cleaning a solder flux. A cleaning agent for removing a solder flux is constituted such that the content of a benzyl alcohol is within 70-99.9 weight% and the content of an amino alcohol is within 0.1-30 weight% in case when the content of a glycol compound is less than 1 weight% relative to the total amount, while the content of the benzyl alcohol is within 15-99 weight% and the content of the amino alcohol is within 0.1-30 weight% in case when the content of the glycol compound is 1-40 weight%. Such a cleaning agent is used for cleaning a flux for lead-free solders or a flux for high-melting-point solders.

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HORI SHIGEO (JP)
TAKAHASHI HISAKAZU (JP)
FURUI HIROHIKO (JP)
NAKATSUKASA HIROKI (JP)

PCT/JP2004/011455

March 10, 2005

August 10, 2004

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KAKEN TECH CO LTD (JP)
HORI SHIGEO (JP)
TAKAHASHI HISAKAZU (JP)
FURUI HIROHIKO (JP)
NAKATSUKASA HIROKI (JP)

C11D7/26; C11D7/32; C11D11/00; H05K3/26; (IPC1-7): C11D7/26; C11D7/32; C11D7/60; H05K3/26

JP2000008080A	2000-01-11
JPH0434000A	1992-02-05
JPH03140486A	1991-06-14
JPH10114899A	1998-05-06
JP2002012894A	2002-01-15
JPS6369897A	1988-03-29

Emori, Kenji (11-3 Shinjuku 1-chom, Shinjuku-ku Tokyo 22, JP)

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