CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD

Title:

CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD

Document Type and Number:

WIPO Patent Application WO/2005/040324

Kind Code:

A1

Abstract:

A cleaning agent for substrates and a cleaning method are disclosed which enable to effectively remove fine particles and impurities (metal impurities) derived from various metals on a substrate surface without roughening the substrate surface, especially the surface of a semiconductor substrate or causing corrosion or oxidation of metal wiring, especially of copper wiring formed on the substrate surface. The cleaning agent and cleaning method further enable to remove carbon defects on the substrate surface at the same time without removing a metal corrosion inhibitor-Cu coating film, especially a Cu-BTA coating film. The cleaning agent for substrates contains [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent and [III] an organic solvent selected from the group consisting of (1) monovalent alcohols, (2) alkoxy alcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles. The method for cleaning a substrate surface is characterized by processing the substrate surface with such a cleaning agent.

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Inventors:

MIZUTA HIRONORI (JP)
KAKIZAWA MASAHIKO (JP)
HAYASHIDA ICHIRO (JP)

Application Number:

PCT/JP2004/015040

Publication Date:

May 06, 2005

Filing Date:

October 13, 2004

Export Citation:

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Assignee:

WAKO PURE CHEM IND LTD (JP)
MIZUTA HIRONORI (JP)
KAKIZAWA MASAHIKO (JP)
HAYASHIDA ICHIRO (JP)

International Classes:

C11D7/26; C11D7/32; C11D7/36; C11D11/00; C23G5/02; C23G5/032; H01L21/306; (IPC1-7): C11D7/60; C11D7/26; C11D7/32; C11D7/36; H01L21/304; B08B3/08

Domestic Patent References:

WO1998045399A1

1998-10-15

Foreign References:

JP2004152925A	2004-05-27
JPH04130100A	1992-05-01
EP1047121A1	2000-10-25
JP2003013266A	2003-01-15
JP2003289060A	2003-10-10
EP0812011A2	1997-12-10
EP0643154A2	1995-03-15
EP0939344A1	1999-09-01
US20030199406A1	2003-10-23

Other References: