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Patent Searching and Data


Title:
CLEANING AGENT
Document Type and Number:
WIPO Patent Application WO/2005/052109
Kind Code:
A1
Abstract:
[PROBLEMS] Disclosed is a cleaning agent which enables to remove particles and metal impurities from a wafer surface at room temperature in a short time using a single liquid without corroding wirings, gates or the like. [MEANS FOR SOLVING PROBLEMS] The cleaning agent is an aqueous solution having a pH of 2-12 and contains a phosphoric acid, a hydrofluoric acid, an ammonia and/or an amine. Specifically, the cleaning agent contains 0.5-25 mass% of a phosphoric acid, 0.1-10 mass% of an ammonia and/or an amine, and from 5 × 10-3 to 5.0 mass% of a hydrofluoric acid.

Inventors:
SUGA SHIGEMASA (JP)
KAMON SHIGERU (JP)
YATA TAKASHI (JP)
TERAI AKIHIRO (JP)
Application Number:
PCT/JP2004/017403
Publication Date:
June 09, 2005
Filing Date:
November 24, 2004
Export Citation:
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Assignee:
KISHIMOTO SANGYO CO (JP)
FINE POLYMERS CORP (JP)
SUGA SHIGEMASA (JP)
KAMON SHIGERU (JP)
YATA TAKASHI (JP)
TERAI AKIHIRO (JP)
International Classes:
B08B3/08; C11D7/06; C11D7/08; C11D7/18; C11D7/32; C11D11/00; C11D17/08; H01L21/304; (IPC1-7): C11D7/08; C11D7/18; C11D7/32; C11D17/08
Domestic Patent References:
WO1997018582A11997-05-22
Foreign References:
JPH0848996A1996-02-20
JPH0641770A1994-02-15
JPH07115077A1995-05-02
JP2001044161A2001-02-16
JPH0745600A1995-02-14
JPH0684866A1994-03-25
JPH07216392A1995-08-15
Other References:
See also references of EP 1688477A4
Attorney, Agent or Firm:
Segawa, Koichi (Suginami-ku, Tokyo, JP)
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