Title:
CLEANING DEVICE FOR VACUUM HOLE OF CHIP BONDING HEAD
Document Type and Number:
WIPO Patent Application WO/2023/185924
Kind Code:
A1
Abstract:
A cleaning device (100) for a vacuum hole of a chip bonding head, comprising a support (10), a bearing assembly (20), and an ejector pin assembly (30); the ejector pin assembly (30) is slidably provided on the support (10); the ejector pin assembly (30) comprises an ejector pin mounting block (31), an ejector pin (301), a positioning block (33) and an ejector pin fine adjustment mechanism; the ejector pin fine adjustment mechanism comprises a fine adjustment member (321), an ejector pin supporting block (32) and a positioning assembly; the fine adjustment member (321) is threadedly connected to the ejector pin mounting block (31); the fine adjustment member (321) is mated with the ejector pin supporting block (32). The positioning of the ejector pin (301) is controlled by controlling the fine adjustment member (321), so that the adjustment precision of a protruding length of the ejector pin (301) is improved.
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| WO/2021/164056 | AUTOMATIC LASER CLEANING MACHINE FOR TIRE MOLD |
Inventors:
CHEN XIULONG (CN)
Application Number:
PCT/CN2023/084687
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
CHIPMORE TECH CORPORATION LIMITED (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
International Classes:
B08B13/00; B08B1/00; B25B11/00
Foreign References:
| CN114733807A | 2022-07-12 | |||
| CN217094569U | 2022-08-02 | |||
| CN114733806A | 2022-07-12 | |||
| CN215590065U | 2022-01-21 | |||
| CN215896358U | 2022-02-22 | |||
| CN111739833A | 2020-10-02 | |||
| CN110112093A | 2019-08-09 | |||
| KR20110052250A | 2011-05-18 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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