Title:
CLEANING FLUID AND CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/210308
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a cleaning fluid for semiconductor substrates which is highly effective in preventing metallic layers from corroding. The present invention further addresses the problem of providing a method for cleaning a semiconductor substrate. This cleaning fluid, which is for semiconductor substrates having undergone chemical mechanical polishing, comprises water and ingredient A having two or more onium structures in the molecule and has a pH at 25°C of 7.0-11.8.
Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2021/009977
Publication Date:
October 21, 2021
Filing Date:
March 12, 2021
Export Citation:
Assignee:
FUJIFILM ELECTRONIC MAT CO LTD (JP)
International Classes:
C11D17/08; B24B37/00; C09K3/14; C11D3/20; C11D3/26; C11D3/34; C11D3/36; C11D7/26; C11D7/32; C11D7/34; C11D7/36; H01L21/304
Domestic Patent References:
| WO2013162020A1 | 2013-10-31 | |||
| WO2020166677A1 | 2020-08-20 |
Foreign References:
| JP2011159658A | 2011-08-18 | |||
| JP2010251680A | 2010-11-04 | |||
| JP2009081200A | 2009-04-16 | |||
| JP2013118361A | 2013-06-13 | |||
| JP2020203980A | 2020-12-24 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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