Title:
CLEANING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/124109
Kind Code:
A1
Abstract:
Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring line, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic ring are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.
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Inventors:
MORITA KIKUE (JP)
TAKANAKA AREJI (JP)
OHWADA TAKUO (JP)
TAKANAKA AREJI (JP)
OHWADA TAKUO (JP)
Application Number:
PCT/JP2017/046737
Publication Date:
July 05, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
KANTO KAGAKU (JP)
International Classes:
H01L21/304; C11D7/32; C11D7/36; C11D17/08; C23G1/20
Domestic Patent References:
| WO2014168166A1 | 2014-10-16 |
Foreign References:
| JP2014212262A | 2014-11-13 | |||
| JP2009278018A | 2009-11-26 | |||
| JP2015165561A | 2015-09-17 | |||
| JP2016086094A | 2016-05-19 | |||
| JP2014212262A | 2014-11-13 |
Other References:
See also references of EP 3564985A4
Attorney, Agent or Firm:
KUZUWA, Kiyoshi (JP)
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