Title:
CLEANING MECHANISM, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/102563
Kind Code:
A1
Abstract:
Provided is a feature for reducing the amount of resin dust being scattered to the surroundings, and for removing resin dust that has adhered to the inside of a holding part that holds a resin. In the present invention, there is configured a cleaning mechanism 5 comprising: an attraction mechanism 52 that attracts a holding part 12 of a conveying mechanism 1, in which a solid resin is held by the holding part 12 and which conveys the solid resin into a resin molding unit; a brush 53 that is driven vertically; and a cover 51 that covers the holding part.
Inventors:
IKENISHI TETSURO (JP)
Application Number:
PCT/JP2021/040943
Publication Date:
May 19, 2022
Filing Date:
November 08, 2021
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
H01L21/56; B29C33/72
Foreign References:
| JPH08238644A | 1996-09-17 | |||
| JPH0752187A | 1995-02-28 | |||
| JPS63161710U | 1988-10-21 | |||
| JP2014083784A | 2014-05-12 | |||
| JPH04120743A | 1992-04-21 | |||
| JPH1071627A | 1998-03-17 | |||
| JP2002313829A | 2002-10-25 | |||
| JPH07156157A | 1995-06-20 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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