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Patent Searching and Data


Title:
CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/262448
Kind Code:
A1
Abstract:
Provided in an embodiment is a cleaning method that can reduce the effects on a substrate and that exhibits an excellent ability to remove resin masks. In an embodiment, the present disclosure relates to a cleaning method comprising a step for detaching, using a cleaning agent composition, a resin mask from an object to be cleaned to which the resin mask is attached, wherein the cleaning agent composition comprises an alkaline agent (component A), an organic solvent (component B), a chelating agent (component C), and water (component D). Component B is at least one solvent selected from glycol ethers and aromatic ketones, and component C is a compound having two or more of at least one acid group selected from the carboxy group and the phosphonic acid group. The content of component B at the time of use of the cleaning agent composition is 1-12 mass%, and the content of component D at the time of use of the cleaning agent composition is 65-95 mass%. The object to be cleaned is provided via a step for executing, with the use of a resin mask, a soldering process and/or a plating process.

Inventors:
YAMADA Kouhei
Application Number:
JP2020/024763
Publication Date:
December 30, 2020
Filing Date:
June 24, 2020
Export Citation:
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Assignee:
KAO CORPORATION (JP)
International Classes:
B08B3/08; C11D7/26; C11D7/36; C11D7/50; G03F7/42; H01L21/027; H01L21/304
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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