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Title:
CLEANING MODULE, SUBSTRATE PROCESSING APPARATUS INCLUDING CLEANING MODULE, AND CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/100609
Kind Code:
A1
Abstract:
The present invention can achieve both buff cleaning of a surface of a substrate and cleaning of an edge portion of the substrate. Disclosed is a cleaning module having: a rotary table for supporting a circular substrate, the rotary module having a diameter smaller than the diameter of the substrate; a buff cleaning unit for buff-cleaning the surface of the substrate supported by the rotary table while being in contact with the surface of the substrate; a buff cleaning unit moving mechanism for moving the buff cleaning unit with respect to the substrate; a buff cleaning unit control mechanism that controls the operation of the buff cleaning unit moving mechanism; and an edge cleaning unit for cleaning an edge portion of the substrate supported by the rotary table while being in contact with the edge portion of the substrate.

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Inventors:
MIZUNO TOSHIO (JP)
HIMORI YOSUKE (JP)
BABA ERINA (JP)
ISHIBASHI TOMOATSU (JP)
KOBATA ITSUKI (JP)
Application Number:
PCT/JP2019/042773
Publication Date:
May 22, 2020
Filing Date:
October 31, 2019
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B41/06; H01L21/304
Foreign References:
JP2010040943A2010-02-18
JP2003151943A2003-05-23
JP2003151925A2003-05-23
JP2018113393A2018-07-19
JP2007317703A2007-12-06
JP2006278592A2006-10-12
JPH0645302A1994-02-18
JP2008084934A2008-04-10
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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